20+ years experience in packing solution

20+ years experience in packing solution

High Density Vertical Packing Machine With Professional Technical Support

  • gm duplex vertical packing machine | general measure technology

    GM Duplex Vertical Packing Machine | General Measure Technology

    General Measure duplex vertical granule packing machine is a high-speed and high-accuracy with a weighing range from 50g to 1kg. The packing speed is up to 3,600 pcs/h. It is suitable for many different materials: salts, sugar, rice, millet, beans, and so on. It is a better choice for replacing multihead combination packing machines and ...

  • gea smartpacker cx400 | vertical packaging

    GEA SmartPacker CX400 | Vertical packaging

    GEA SmartPacker CX400 is a high-capacity, continuous motion vertical packaging machine, supporting pillow and more styles for various food applications. Whether you need your your food products pack-ready for retail or foodservice, GEA SmartPacker CX400 is your ultimate choice in terms of capacity, technical options and range of bag styles.

  • chips packing machine - coalza

    Chips packing machine - Coalza

    Our SR300 vertical packaging machine is the best solution for potato chip packaging lines, as it provides quality packaging and reduces production times. Maximum packaging speed: Due to the fragility, density and morphology of the product, snacks and crisps are packaged at maximum speeds of 50 to 65 bpm. Film transport by means of built-in ...

  • fsu800rt - fres-co system usa

    FSU800RT - Fres-co System USA

    The FSU800RT is a fully automatic vertical form, fill and seal packaging machine specifically designed with ultrasonic sealing for retort applications. Product applications include multi-phase filling of liquids and solids for shelf-stable food products. Also available as a variation of the FSU800RT is the FSU800RTC, a fully integrated VFFS ...

  • sevana vertical vacuum packing machine | perfect solution for ...

    Sevana Vertical Vacuum Packing Machine | Perfect solution for ...

    Designed with precision and airtight packing efficiency in mind, this cutting-edge machine is guaranteed to meet all your packaging needs. The Double Chamber Vertical Vacuum Packing Machine (Tiltable) takes productivity to new heights with its two spacious chambers. With double the capacity, you can package more briquettes in less time ...

  • machine overview - wolf-packaging

    Machine Overview - wolf-packaging

    The packaging machines series VPC are vertical high-performance machines which provide a unique price-performance ratio. For free-flowing, pourable and pasty products the VPC packaging machines offer a gentle product handling and efficient packaging process: Continuous or intermittent operating mode. For bag widths of 50-250 mm VPC 250.

  • modeling of 3-d vertical interconnect using support vector ...

    Modeling of 3-D Vertical Interconnect Using Support Vector ...

    In this letter, the support vector machine (SVM) regression approach is introduced to model the three-dimensional (3-D) high density microwave packaging structure. The SVM is based on the structural risk minimization principle, which leads to a good generalization ability. With a 3-D vertical interconnect used as an example, the SVM regression model is electromagnetically developed with a set ...

  • machine overview - wolf-packaging

    Machine Overview - wolf-packaging

    The vertical packaging machine VPC-H, with a low product drop-height, was specially developed for sweets and confectionery. Up to 200 bags/min. Just like every WOLF packaging machine, the VPC-H 250 is able to convinces with a high performance, newest technology and an extremely advantageous price. It was consequently developed for the packaging ...

  • process modules for high-density interconnects in panel-level ...

    Process Modules for High-Density Interconnects in Panel-Level ...

    Advanced packaging technologies like wafer-level fan-out and 3-D system-in-package (3-D SIP) are rapidly penetrating the market of electronic components. For cost reduction, one approach is the migration of processes from wafer to panel format, called panel-level packaging (PLP). In a consortium of partners from industry and research, advanced technologies for PLP are developed. The project ...

  • high density vertical interconnects for 3-d integration of ...

    High density vertical interconnects for 3-D integration of ...

    This paper describes a technology platform being developed for three-dimensional (3-D) integration of thin stacked silicon integrated circuits (ICs). 3-D integration technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator array devices hybridized with silicon read-out electronics. Currently, advanced 3-D integrated infrared focal ...

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